Circuit Board Repair
Our board repair and validation services include:
Testing
Troubleshooting
Failure analysis
Reverse engineering
for comprehensive analysis and repair
We service:
Ball Grid Array (BGA) Microchips
micro Ball Grid Array (µ-BGA) Microchips
Leaded-type components
(BGA, CGA, QFP, LCC, TSOP, etc.)
RoHS and non-RoHs Boards
Montech's state-of-the-art equipment ensures that no damage is done to the boards or its components that would deem the board not repairable or cause premature failure and their customers.
Our board repair service extends to both current and out-of-production equipment and components.
We service boards used in:
Test equipment
Calibration equipment
Communciations equipment
Computers
Printers
Industrial electronics
Audio and video equipment
Special Services
Asset recovery
Customized package design for damage-free shipping
EPA-approved waste disposal
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Board and Component Capacity
• 2 x 2 inch minimum
• 14 x 18 inch substrate
• PCB thickness
up to 0.25 inch (6.4 mm)
• Removal of components
up to 1.5 inches tall
• 0.08 inch (2.0 mm) square
minimum component size
• 2 inch (51 mm) square
maximum component size
• Placement accuracy
to +/- 0.002 inches
• Factory calibrated with
split-prism for BGA alignment
• High melting temperatures
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